Method and apparatus for populating an adhesive sheet with particles
AssigneeTexas Instruments Incorporated
InventorsGregory B. Hotchkiss, Robert J. Lessard
Life of this patent
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Abstract
A method for assembling electronic devices by moving particles (12) on an adhesive sheet (35) having a plurality of adhesive areas (30), comprising the steps of loading the particles (12) onto the adhesive sheet (35) and transferring kinetic energy from a mechanical device (39) to the particles (12) for moving the particles (12) is disclosed. The adhesive sheet (35) may be composed of an adhesive coating (22) laminated to a film (24). The particles (12) may be composed of a variety of materials, including minerals and compounds such as solder or polymers.
Claims19
A method for assembling electronic devices by populating electrically conductive particles on an adhesive sheet having a plurality of adhesive areas, comprising the steps of:
- loading the particles onto the adhesive sheet;
- and
- transferring kinetic energy from a mechanical device to the particles, said energy comprising a vertical force.
A method for attaching solder particles to a substrate, comprising the steps of:
- obtaining an adhesive sheet having a plurality of adhesive areas;
- loading the solder particles to said adhesive sheet;
- transferring kinetic energy from a mechanical device to the solder particles for distributing the solder particles on said adhesive sheet;
- transferring kinetic energy to the solder particles for removing the solder particles not adhered to said plurality of adhesive areas;
- aligning the solder particles attached to said plurality of adhesive areas with contact pads of the substrate;
- securely attaching the solder particles to said contact pads;
- and
- removing said adhesive sheet from the solder particles.
A method for assembling electronic devices by populating electrically conductive particles on an adhesive sheet having a plurality of adhesive areas, comprising the steps of:
- loading the particles onto the adhesive sheet;
- and
- transferring kinetic energy from a vibrating pencil to the particles.
A method for assembling electronic devices by populating electrically conductive particles on an organic film having a plurality of adhesive areas, comprising the steps of:
- loading the particles onto the film;
- and
- transferring kinetic energy from a mechanical device to the particles.
A method for assembling electronic devices by populating electrically conductive polymeric particles on an adhesive sheet having a plurality of adhesive areas, comprising the steps of:
- loading the particles onto the adhesive sheet;
- and
- transferring kinetic energy from a mechanical device to the particles.
A method for assembling a semiconductor wafer by populating electrically conductive particles on an adhesive sheet having a plurality of adhesive areas, comprising the steps of:
- loading the particles onto the adhesive sheet;
- transferring kinetic energy from a mechanical device to the particles;
- and transferring selected particles from said sheet to said wafer.
A method for assembling electronic devices by populating electrically conductive particles on an adhesive sheet having a plurality of adhesive areas, comprising the steps of:
- loading the particles onto the adhesive sheet;
- transferring kinetic energy from a mechanical device to the particles;
- and
- placing the populated sheet in an ionizing environment for preventing tribocharging.
Dependencies are inferred from the claim text.