Method and apparatus for applying viscous materials to a lead frame

A method for applying flowable material to a lead frame, comprising:

• placing flowable material on a surface;
• forming a film of the flowable material on the surface;
• bringing a portion of the lead frame and the film of flowable material into contact with one another;
• separating the portion of the lead frame from the film of flowable material on the surface;
• and leaving flowable material on the portion of the lead frame.

A method for applying flowable material to a lead frame, comprising:

• providing a carrier surface and an array of orifices in fluid communication with the surface;
• feeding a flowable material through the orifices on to the surface;
• and
• bringing a portion of the lead frame and the flowable material into contact with one another.

A method for applying viscous material to lead fingers on a lead frame, comprising:

• dispensing adhesive material on to a surface;
• spreading the adhesive material to a uniform thickness;
• bringing the lead fingers material into contact with one another;
• separating the lead fingers from the adhesive material on the surface;
• and
• leaving adhesive material on the lead fingers.

A method for applying adhesive material to lead fingers on a lead frame, comprising:

• placing adhesive material on to a surface;
• spreading the adhesive material to a uniform thickness;
• offsetting at least a portion of the lead fingers from other portions of the lead frame;
• dipping the offset portions of the lead fingers in the adhesive material;
• removing the offset portions of the lead fingers from the adhesive material on the surface;
• and
• leaving adhesive material on the offset portions of the lead fingers.

A method for attaching a semiconductor die to a lead frame having a plurality of lead fingers configured to extend across a surface of the die, the method comprising:

• forming a film of adhesive material on a carrier surface;
• bringing a die attach portion of the lead fingers and the film of adhesive material into contact with one another;
• separating the die attach portion of the lead fingers from the film of adhesive material on the carrier surface;
• leaving adhesive material on the die attach portion of the lead fingers;
• and
• pressing the die and the die attach portion of the lead fingers together.

A method for attaching a semiconductor die to a lead frame having a plurality of lead fingers configured to extend across a surface of the die, the method comprising:

• offsetting a die attach portion of the lead fingers from the other portions of the lead frame
• forming a film of adhesive material on a carrier surface;
• dipping the die attach portion of the lead fingers in the film of adhesive material;
• removing the offset portions of the lead fingers from the adhesive material on the carrier surface;
• leaving adhesive material on the die attach portion of the lead fingers;
• and
• pressing the die and the die attach portion of the lead fingers together.