Method for attaching a die to a carrier utilizing an electrically nonconductive layer

A method of attaching an integrated circuit die to a carrier comprising the steps of:

• A) attaching ball bonding balls to conductive pads on a first side of said integrated circuit die;
• B) applying at least one layer electrically non-conductive of a mounting material to said first side of said carrier, said mounting material being substantially unsusceptible to outgassing in ultrahigh vacuum environments at temperatures at least up to about 900 degrees C.;
• C) removing portions of said mounting material to expose conductive pads on said first side of said carrier;
• D) registering said attached bonding balls on said first side of said integrated circuit die with conductive pads on a first side of said carrier;
• and
• E) under controlled temperature conditions, applying pressure to join said integrated circuit die and said carrier.

A method of attaching an integrated circuit die to a carrier, wherein said integrated circuit die has a first side including a plurality of conductive pads, the method comprising the steps of:

• A) providing a electrically non-conductive thin layer of a mounting material between said integrated circuit die and said carrier, said mounting material being substantially unsusceptible to outgassing in ultrahigh vacuum environments at temperatures at least up to about 900 degrees C.;
• B) reflowing said mounting material to attach said integrated circuit die to said carrier;
• C) removing a portion of integrated circuit die to expose at least a portion of at least two of said plurality of said conductive pads;
• D) electrically connecting said exposed portions of said conductive pads to conductive pads on said carrier.