Method for manufacturing a substrate of a liquid crystal display device

A method for manufacturing an LCD, comprising the steps of:

• forming a first conductive layer over a substrate;
• forming a protection layer over the first conductive layer, wherein the protection layer is formed of a light developable organic material;
• developing the light developable organic layer using a photo mask;
• etching the light developable organic until a residual portion of the light developable organic layer remaining over the exposed surface of the first conductive layer is removed;
• forming a second conductive layer which is in contact with the exposed first conductive layer and which covers a part of the surface of the etched light developable organic layer;
• and
• forming a switching element at a lower portion of the light developable organic layer.

A method for manufacturing an LCD, comprising the steps of:

• forming a thin film transistor over a substrate, the thin film transistor including a drain electrode, a data pad and a data insulating layer over a gate pad;
• forming a light developable organic layer over an entire surface of the substrate on which the thin film transistor is formed, the light developable organic layer including a material selected from the group consisting of a light developable acryl organic layer, an F-added light developable polyimide, a light developable teflon, a light developable cytop and a light developable parylene;
• partially exposing a part of the drain electrode, a part of the data pad and a gate insulating layer over the gate pad;
• removing a residual portion of the light developable organic layer remaining on the surface of the drain electrode and the data pad to simultaneously expose the surface of the gate pad;
• and
• forming a transparent conductive layer which is in contact with the exposed drain electrode, data pad and gate pad and which covers a part of the surface of the etched light developable organic layer.

A method for manufacturing an LCD, comprising the steps of:

• forming a first conductive layer over a substrate;
• forming a protection layer over the first conductive layer, the protection layer being formed of a light developable organic material, and the light developable organic layer including a material selected from the group consisting of a light developable acryl organic layer, an F-added light developable polyimide, a light developable teflon, a light developable cytop, and a light developable parylene;
• developing the light developable organic layer using a photo mask;
• etching the light developable organic until a residual portion of the light developable organic layer remaining over the exposed surface of the first conductive layer is removed;
• forming a second conductive layer which is in contact with the exposed first conductive layer and which covers a part of the surface of the etched light developable organic layer;
• and
• forming a switching element at a lower portion of the light developable organic layer.