Semiconductor device with unbreakable testing elements for evaluating components and process of fabrication thereof

A process of fabricating a semiconductor device, comprising the steps of:

• a) preparing a semiconductor substrate having a major surface containing a first area and a second area;
• b) forming an inter-level insulating structure over said major surface of said semiconductor substrate;
• c) forming a spacing layer on said inter-level insulating structure;
• d) removing a part of said spacing layer from a part of said inter-level insulating layer over said second area;
• e) forming a certain layer extending over a remaining part of said spacing layer over said first area and said part of said inter-level insulating layer;
• f) patterning said certain layer into a first member of at least one circuit component on said remaining part of said spacing layer and at least one second member of a testing element on said part of said inter-level insulating layer;
• g) removing said remaining part of said spacing layer so that said first member projects from said remaining part of said spacing layer;
• h) evaluating said first member by measuring a predetermined physical quantity of said at least one second member;
• and
• i) completing said at least one circuit component.