Circuit and a method for configuring pad connections in an integrated device
AssigneeMicron Technology, Inc.
InventorsJeffrey P. Wright, Hua Zheng
Life of this patent
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Abstract
An integrated device includes a configuration circuit that is coupled to first and second bond pads and first and second conductive paths of the integrated device. The circuit receives a map signal that has a first value during a first operational mode of the integrated device and a second value during a second operational mode of the integrated device. In response to the first value, the circuit couples the first pad to the second conductive path. In response to the second value, the circuit couples the first pad to the first conductive path and the second pad to the second conductive path. The first operational mode may be a wafer test mode.
Claims6
A method for testing a first circuit in a semiconductor chip having a plurality of inaccessible pads disposed on a first side inaccessible to a testing apparatus and further having a plurality of accessible pads disposed on a second side accessible to the testing apparatus, the first circuit coupled to receive a signal applied to a selected one of the plurality of inaccessible pads during a first mode, the method comprising:
- applying test signals generated by the testing apparatus to the plurality of accessible pads;
- providing the test signal applied to a selected one of the plurality of accessible pads to the first circuit during a second mode;
- and
- decoupling the selected one of the plurality of inaccessible pads from the first circuit during the second mode.
Dependencies are inferred from the claim text.