Loading patent…
AssigneeKulicke & Soffa Holdings, Inc.
InventorsScott M. Westbrook, Jan I. Strandberg
Estimating the term…
A method for forming a high density interconnect printed wiring board substrate that has a first patterned conductive layer formed over an upper surface of the substrate that includes multiple conductive lines having edges that define the boundaries of the conductive lines and a dielectric layer formed over the patterned conductive layer and between the edges of the conductive lines. The method includes forming a thin film conductive layer over the dielectric layer, and patterning the thin film conductive layer such that, after the patterning step, the thin film conductive layer overlies each of the edges of the conductive lines. In a preferred embodiment, the thin film conductive layer is patterned such that, after the patterning step, the layer overlies the edges of the conductive lines by at least 10 microns. In another aspect of the invention, a method for strengthening thin film build-up layers deposited over a high density interconnect common circuit base is taught. According to this aspect, a photo-definable thin film dielectric layer having a coefficient of expansion of less than about 10% is formed over a patterned conductive layer, and a thin film conductive layer is formed over the photo-definable thin film dielectric layer. The thin film conductive layer is then patterned to include a plurality of signal lines and a plurality of thieving lines with the thieving lines being placed between nonuniformly spaced signal lines to provide a substantially uniform combined pattern of signal lines and thieving lines.
A method for forming a high density interconnect printed wiring board substrate having a first patterned conductive layer formed over an upper surface of the substrate, said first patterned conductive layer including a plurality of conductive lines having edges that define boundaries of said conductive lines, said substrate also having a dielectric layer formed over said first patterned conductive layer and between the edges of said conductive lines, said method comprising:
A method for forming a high density interconnect printed wiring board substrate having a first patterned conductive layer formed over an upper surface of the substrate, said first patterned conductive layer including a plurality of conductive lines having edges that define boundaries of said conductive lines, said substrate also having a dielectric layer formed over said first patterned conductive layer and between the edges of said conductive lines, said method comprising:
A method for forming a high density interconnect printed wiring board substrate having a first patterned conductive layer formed over an upper surface of the substrate, said first patterned conductive layer including a plurality of conductive lines having edges that define boundaries of said conductive lines, said substrate also having a dielectric layer formed over said first patterned conductive layer and between the edges of said conductive lines, said method comprising:
A method for forming a high density interconnect printed wiring board substrate having a first patterned conductive layer formed over an upper surface of the substrate, said first patterned conductive layer including a plurality of conductive lines having edges that define boundaries of said conductive lines, said substrate also having a dielectric layer formed over said first patterned conductive layer and between the edges of said conductive lines, said method comprising:
A method for forming a high density interconnect printed wiring board substrate having a first patterned conductive layer formed over an upper surface of the substrate, said first patterned conductive layer including a plurality of conductive lines having edges that define boundaries of said conductive lines said substrate also having a dielectric layer formed over said first patterned conductive layer and between the edges of said conductive lines, said method comprising:
A method for forming a high density interconnect printed wiring board substrate having a first patterned conductive layer formed over an upper surface of the substrate, said first patterned conductive layer including a plurality of conductive lines having edges that define boundaries of said conductive lines, said substrate also having a dielectric layer formed over said first patterned conductive layer and between the edges of said conductive lines, said method comprising:
A method for forming a high density interconnect printed wiring board substrate having a first patterned conductive layer formed over an upper surface of the substrate, said first patterned conductive layer including a plurality of conductive lines having edges that define boundaries of said conductive lines, said substrate also having a dielectric layer formed over said first patterned conductive layer and between the edges of said conductive lines, said method comprising:
A method for reducing thermally generated sheer stress cracking at an interface between an edge of a conductive line and insulative layer in a high density interconnect printed wiring board substrate, said method comprising:
A method for strengthening thin film build-up layers deposited over a high density interconnect common circuit base, said method comprising:
Dependencies are inferred from the claim text.