Corrosion-free multi-layer conductor
AssigneeInternational Business Machines Corporation
InventorsUmar Moez Uddin Ahmad, Harsaran Singh Bhatia, Satya Pal Singh Bhatia, Hormazdyar Minocher Dalal, William Henry Price, Sampath Purushothaman
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Abstract
A corrosion resistant, multi-layer structure on a substrate including an adhesion metallic layer on the substrate, a cushion metallic layer on the adhesion layer, a diffusion barrier layer on the cushion layer, and an impermeable gold layer that encapsulates all the layers, is substantially even on all sides of the layers, and contacts a region on the substrate adjacent the layers to prevent oxidation and corrosion.
Claims14
A corrosion resistant, multi-layer metal structure on a substrate, comprising in combination;
- an adhesion metallic layer formed on said substrate;
- a cushion metallic layer formed on said adhesion layer;
- a diffusion barrier layer formed on said cushion layer;
- and
- an impermeable gold layer that encapsulates said adhesion layer, said cushion layer and said diffusion barrier layer and spreading substantially evenly on sides of said adhesion layer, said cushion layer and said diffusion barrier layer and further contacting a region on said substrate adjacent said multi-layer metal structure to prevent oxidation and corrosion.
A corrosion resistant, multi-layer metal structure on a substrate, comprising in combination;
- an adhesion metallic layer formed on said substrate;
- a cushion metallic layer formed on said adhesion layer;
- and
- an impermeable gold layer that encapsulates said adhesion layer and said cushion layer and spreading substantially evenly on sides of said adhesion layer and said cushion layer and further contacting a region on said substrate adjacent said multi-layer metal structure to prevent oxidation and corrosion.
A corrosion resistant, multi-layer metal structure on a substrate, comprising in combination;
- an adhesion metallic layer formed on said substrate;
- a cushion metallic layer formed on said adhesion layer;
- a diffusion barrier layer formed on said cushion layer;
- and
- an impermeable gold layer that encapsulates said adhesion layer and said cushion layer and said diffusion barrier layer, said gold layer formed by a process of evaporation while said substrate is held at an elevated temperature causing said gold layer to spread substantially evenly on sides of said adhesion layer, said cushion layer and said diffusion barrier and further contacting a region on said substrate adjacent said multi-layer metal structure to prevent oxidation and corrosion.
A corrosion resistant, multi-layer metal structure on a substrate formed by a process including the steps of
- depositing a first metallic layer through an opening in a mask onto a substrate,
- depositing a second metallic layer through said mask opening onto said first metallic layer,
- depositing gold through said mask opening to cover the first and second metallic layers, the gold layer being spread substantially evenly on sides of said first and second metallic layers and contacting a region on said substrate adjacent said first and second metallic layers to prevent oxidation and corrosion while maintaining said substrate at a temperature in a range between 130° C. and 200° C.
Dependencies are inferred from the claim text.