Multiple frequency processing to minimize manufacturing variability of high aspect ratio micro through-vias
AssigneeW. L. Gore & Associates, Inc.
InventorDavid B. Noddin
Life of this patent
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Abstract
A method for forming a through-via in a laminated substrate by laser drilling the through-via in a laminated substrate from a top exposed surface of the substrate to a bottom exposed surface of the substrate using a plurality of laser pulses that are trepanned in a first predetermined pattern. Each pulse trepanned in the first predetermined pattern has a first energy density per pulse. Then, the through-via is laser drilled using a plurality of laser pulses that are trepanned in a second predetermined pattern. Each pulse trepanned in the second predetermined pattern has a second energy density per pulse that is greater than the first energy density per pulse. The second predetermined pattern is within the first predetermined pattern.
Claims12
A laminated substrate comprising:
- a core layer;
- at least one lamina formed on the core layer, each lamina having a bottom dielectric layer and a top conductive layer formed on the dielectric layer;
- and
- at least one via extending through at least an outermost lamina, each via having an entrance aperture in the conductive layer of the outermost lamina, each respective entranace aperture having an entrance width equal to or less than 75 μm, wherein at least one via is a through-via having an aspect ratio equal to or greater than 10:1 and an exit with a variance in width of about 10 μm2.
A laminated substrate comprising:
- a core layer;
- at least one lamina formed on the core layer, each lamina having a bottom dielectric layer and a top conductive layer formed on the dielectric layer;
- and
- at least one via extending through at least an outermost lamina, each via having an entrance aperture in the conductive layer of the outermost lamina, each respective entranace aperture having an entrance width equal to or less than 75 μm, wherein at least one via is a through-via having an aspect ratio equal to or greater than 15:1 and an exit with a variance in width of about 10 μm2.
Dependencies are inferred from the claim text.