Process for treating waste water containing copper
AssigneeKoch Microelectronic Service Company, Inc.
InventorsDustin Kimbel James, Deon Eugene Campbell, Thuy Nguyen
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AssigneeKoch Microelectronic Service Company, Inc.
InventorsDustin Kimbel James, Deon Eugene Campbell, Thuy Nguyen
Estimating the term…
A process for treating waste water containing copper and other particles from a chemical mechanical planarization (CMP) process is provided. This process includes adjusting the pH of the waste water to between about 3 and 4, adding a coagulant or flocculating polymer to the waste water to generate larger particles, filtering the waste water through a filtration unit to produce a permeate and solids, feeding the permeate through a carbon bed to remove total organic carbon, and feeding the carbon bed treated permeate through an ion exchange column to remove copper from the permeate. This process may further involve washing sludge collected in a concentration tank with the treated stream exiting the ion exchange column. Still further, another aspect of the present invention is a system for performing the process described above.
A process for treating waste water containing copper and other particles from a chemical mechanical planarization (CMP) process, comprising:
A process for treating waste water containing copper and other particles from a chemical mechanical planarization (CMP) process, comprising:
A process for treating waste water containing copper and other particles from a chemical mechanical planarization (CMP) process, comprising:
Dependencies are inferred from the claim text.