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US 6,203,658 B1Granted
Processing system and method for making spherical shaped semiconductor integrated circuits
AssigneeBall Semiconductor, Inc.
InventorAkira Ishikawa
Life of this patent
Estimating the term…
Abstract
A spherical shaped semiconductor integrated circuit (“ball”) and a system and method for manufacturing same. The ball replaces the function of the flat, conventional chip. The physical dimensions of the ball allow it to adapt to many different manufacturing processes which otherwise could not be used. Furthermore, the assembly and mounting of the ball may facilitates efficient use of the semiconductor as well as circuit board space.
Claims1
A system for polishing a spherical shaped semiconductor comprising:
- an outer pipe having an inside diameter;
- an inner pipe coaxial with the outer pipe, the inner pipe having a first, second and third section wherein the first section has a first outside diameter, the second section has a second outside diameter greater than the first diameter, and the third section connects the first and second sections and has a third outside diameter that varies from the first diameter to the second diameter;
- wherein the inside diameter of the outer pipe is less than the second outside diameter of the inner pipe;
- wherein, when the inner pipe rotates about the axis, with respect to the outer pipe, the spherical shaped semiconductor is polished.
1 more element
Dependencies are inferred from the claim text.