Method of forming a via in a substrate
AssigneeInternational Business Machines Corporation
InventorsFrank D. Egitto, John S. Kresge
Life of this patent
Estimating the term…
Abstract
A method of forming a via in a substrate is provided. The method generally includes laminating a support to the substrate, forming the via in the substrate, and then stripping the support from the substrate. The support is preferably a photoresist that collects any debris generated by the via formation so that the debris is removed from the via and substrate surface as the photoresist support is stripped.
Claims18
A method of forming a via in a substrate, comprising the following steps:
- laminating a photoresist support to the substrate;
- after the laminating step, forming a via in the substrate;
- and
- after the forming step, stripping the support from the substrate.
A method of forming a via in a substrate, comprising the following steps:
- providing the substrate;
- laminating a photoresist support to the substrate;
- after the laminating step, forming at least one via through the substrate;
- and
- after the forming step, removing debris produced by the forming step by stripping the support from the substrate.
A method of forming a via in a substrate, comprising the following steps:
- providing the substrate;
- laminating a photoresist support to the substrate exposing the photoresist support to strengthen the support;
- after the laminating step, forming a via in the substrate;
- and
- after the forming step, stripping the photoresist support from the substrate.
Dependencies are inferred from the claim text.