Variable pressure plate CMP carrier
AssigneeChartered Semiconductor Manufacturing Ltd.
InventorSer Wee Quek
Life of this patent
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AssigneeChartered Semiconductor Manufacturing Ltd.
InventorSer Wee Quek
Estimating the term…
An apparatus for removably positioning a semiconductor wafer for polishing. The apparatus including a rotating member with a major lower surface having a plurality of recesses each with a conduit path radially leading to a smaller circular pattern of portholes disposed near the center of the rotating member, the recesses are arranged in concentric segments. A nozzle plate covers the major lower surface defining a plurality of chambers therebetween. The nozzle plate includes a radial pattern of gas dispensing orifices which are aligned centrally relative to each chamber. A preset regulated gas pressure communicates with each orifice pattern to exert an opposing force against a force urging the article against the polishing pad. At least two of the orifice patterns have gas pressures adjusted independently from one another so that independent pressure control creates varying forces to be exerted against the back side of the wafer.
In an equipment used to polish a planar article having a frontside surface and a backside surface in which the article is lifted by said backside surface and placed upon a rotating polishing pad for polishing said frontside surface, an apparatus for removably positioning said article for polishing, comprising:
In an equipment used to polish a planar article having a frontside surface and a backside surface in which the article is lifted by said backside surface and placed upon a rotating polishing pad for polishing said frontside surface, a method for removably positioning said article for polishing, comprising the steps of:
Dependencies are inferred from the claim text.