Attachment structure of semiconductor device socket
AssigneeFujitsu Limited
InventorsKazuhiro Tashiro, Daisuke Koizumi
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Abstract
An attachment structure between a semiconductor device socket and a test circuit substrate is provided. The semiconductor device socket includes a socket body and a contact film disposed therein. Extension conductive wires extended from a contact portion to be connected to a semiconductor device are formed on the contact film. The contact film is also provided with socket connectors connected to the extension conductive wires. The test circuit substrate is provided with circuit substrate connectors corresponding to the socket connectors. The socket connectors and the circuit substrate connectors are in a male-female connector relationship.
Claims11
An attachment structure of a semiconductor device socket, comprising:
- a socket body;
- a circuit substrate to which the semiconductor device socket is attached;
- a contact film formed in the socket body and provided with conductive wires and a contact portion to which a semiconductor device is connected;
- socket connectors connected to the conductive wires formed on the contact film;
- and
- circuit substrate connectors formed on the circuit substrate for connections with the socket connectors,
- wherein the socket connectors and the circuit substrate connectors are in a male-female connector relationship.
Dependencies are inferred from the claim text.