Method and apparatus for placing conductive preforms
OwnerEric Hertzinventor
Life of this patent
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Abstract
A method and apparatus are disclosed for placing solder balls 201 on electronic pads 1204 on a substrate 1202, such as for a ball grid array (BGA) applicator 10. The solder balls 201 are held to openings 102 in a foil 22 such as by vacuum force 1607 applied to the solder balls 201 through the openings 102 in a foil 22. After locating the solder balls 201 at electronic pads 1204 on a substrate 1202, by deactivating the vacuum force 1607 and optionally applying a release force 1703 the solder balls 201 are released and placed on the electronic pads 1204. Optionally, a release mechanism 2400 applies placing force 2600 to the solder balls 201 through the openings 2404 in the foil 2403.
Claims23
A method for placing a plurality of conductive preforms on a plurality of electronic pads, the method comprising the steps of:
- holding a plurality of conductive preforms at least partially within a plurality of openings in a foil wherein the openings have at least one exposed diameter that is equal to or larger then the diameter of the conductive preforms by providing a holding force to the plurality of conductive preforms;
- locating the plurality of conductive preforms at a plurality of electronic pads;
- and
- placing the plurality of conductive preforms on the plurality of electronic pads by removing the holding.force from the plurality of conductive preforms.
An apparatus for placing a plurality of conductive preforms on a plurality of electronic pads, the apparatus comprising:
- a foil including a plurality of openings therein for holding and placing a plurality of conductive preforms at least partially within the plurality of openings, wherein the openings have at least one exposed diameter that is equal to or larger then the diameter of the conductive preform;
- and
- means for removably providing a holding force to the plurality of conductive preforms for holding the plurality of conductive preforms at least partially within the plurality of openings and for placing the plurality of conductive preforms on a plurality of electronic pads on a substrate by removing the holding force from the plurality of conductive preforms.
An apparatus for placing a plurality of conductive preforms on a plurality of electronic pads on a substrate, the apparatus comprising:
- a foil including a plurality of openings therein for holding a plurality of conductive preforms to the plurality of openings, wherein the openings have at least one exposed diameter that is equal to or larger then the diameter of the conductive preforms, by a holding force applied to the plurality of conductive preforms through the plurality of openings;
- a supporting structure mechanically coupled to the foil for supporting the foil;
- and
- means for removably providing the holding force to the plurality of conductive preforms through the plurality of openings in the foil for holding the plurality of conductive preforms to the plurality of openings and for placing the plurality of conductive preforms on a plurality of electronic pads on a substrate by removing the holding force from the plurality of conductive preforms.
A apparatus for placing a plurality of conductive preforms on a plurality of electronic pads, the apparatus comprising:
- a foil including a plurality of openings therein for holding and placing a plurality of conductive preforms in the plurality of openings, wherein the openings have at least one exposed diameter that is equal to or larger then the diameter of the conductive preforms;
- means for removably providing a holding force to the plurality of conductive preforms in the plurality of openings of the foil, wherein the holding force holds the plurality of conductive preforms in the plurality of openings and a means for removing the holding force for placing the plurality of conductive preforms onto a plurality of electronic pads on a substrate;
- and
- a second member whereby, the second member is used to maintain the solder spheres in the plurality of openings in the foil.
Dependencies are inferred from the claim text.