Ultrasonic vibration bonding method
AssigneeUltex Corporation
InventorShigeru Sato
Life of this patent
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Abstract
An ultrasonic vibration bonding method comprising placing metal portions to be bonded formed on a base portion of a first member upon metal portions to be bonded of a second member, pressing the first and second members with a resonator and a mounting table elastically while the base portion of the first member is located on a bonding working portion side of the resonator and the second member is located on a mounting table side, and bonding together the portions to be bonded of the first and second members with ultrasonic vibration transmitted to the resonator from a transducer. This ultrasonic vibration bonding method can improve work efficiency and prevent a connection failure and resin breakage.
Claims6
An ultrasonic vibration bonding method by using an ultrasonic vibration bonding unit having a mounting table and a bonding working portion above said mounting table, comprising the steps of:
- elastically pressing a first member having a first base portion and first bond portions provided on said first base portion and a second member having a second base portion and second bond portions between said bonding working portion and said mounting table so that all of said first and second bond portions are brought into close contact with each other without damage to said base portions;
- and
- supplying a high-frequency energy to said bonding working portion to bond said first and second bond portions together.
Dependencies are inferred from the claim text.