Hybrid integrated circuit for a gas sensor
AssigneeSamsung Electronics Co., Ltd.
InventorsViktor Anatolievich Iovdalsky, Igor Mikhailovich Olikhov, Ilya Markovich Bleivas, Vladimir Mikhailovich Ipolitov
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AssigneeSamsung Electronics Co., Ltd.
InventorsViktor Anatolievich Iovdalsky, Igor Mikhailovich Olikhov, Ilya Markovich Bleivas, Vladimir Mikhailovich Ipolitov
Estimating the term…
A hybrid integrated circuit of a gas sensor, comprising a substrate (1) in the form of a ring-shaped peripheral portion (2) and a disk-shaped central portion (3), both being interconnected through three jumpers (4) spaced 120° apart and having three branchings (10) arranged at 120° at the peripheral portion (2). The central portion (3) carries a gas-sensitive film (7), a film heater (6), and a film electrode (8) of the circuit for measuring the resistance of the gas-sensitive film (7). The heater (6) and the electrode (8) are electrically connected along the jumpers (4) to bonding pads (5) located in the peripheral portion (2). The thickness of the jumpers (4) and of the central portion (3) is 0.15-0.25 mm, and the width of the jumpers (4) is 0.05-0.15 mm.
A hybrid integrated circuit of a gas sensor, comprising a substrate (1) in the form of a mechanically strong peripheral portion (2) and a central disk portion (3) thermally insulated therefrom, both portions being interconnected through a group of three jumpers (4) having a certain width and a special length chosen within a proper range, the peripheral portion (2) of the substrate (1) has a central opening characterized by an inside diameter circumference and is provided with a set of three film bonding pads (5), the central portion (3) fitting within said circumference carries a film heater (6), a gas-sensitive film (7), and a film electrode (8) of a circuit for measuring the resistance of the gas-sensitive film (7), all these components being electrically connected to the bonding pads (5) through film conductors (9) located on the jumpers (4), CHARACTERIZED in that the peripheral portion (2) of the substrate (1) is ring-shaped, the central portion (3) thereof is shaped as a disk electrically connected to the peripheral portion (2) by three jumpers (4) spaced 120° apart around the gas sensor, the three jumpers (4) have a triad of branchings (10) arranged at an angle spacing of 120° around the gas sensor at a circular set of three places of connection to the peripheral portion (2), the ratio between the diameter of the central portion (3) and the inside diameter of the peripheral portion (2) is 0.2-0.4, and the ratio between the length of the jumper (4) from the center of the circuit to the radius of the branchings (10) reaching said places of connection and the inside diameter of the peripheral portion (2) is 0.6-0.8, while the width of the jumpers (4) is 0.05-0.15 mm and the thickness of the jumpers (4) and of the central portion (3) of the substrate (1) is 0.15-0.25 mm.
Dependencies are inferred from the claim text.