Non-damage transport system by ice condensation
AssigneeBell Semiconductor, LLC
InventorTakashi Kanatake
Life of this patent
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Abstract
A method and system for transporting objects without causing harmful physical contact is disclosed. The method and system can be used in a manufacturing process for fabricating spherical shaped semiconductor devices. The method cools the spherical shaped device and applies moisture such as de-ionized water. The moisture forms a coat of ice on an outer surface of the cooled spherical shaped device. The spherical shaped device with the coat of ice can then be easily transported, the ice preventing any harmful physical contact to the device. Once the spherical shaped device with the coat of ice has been transported, the device is heated to remove the coat of ice therefrom
Claims14
A method for transporting a substantially spherical shaped device, the method comprising the steps of:
- cooling the spherical shaped device;
- applying moisture to form a coat of ice on an outer surface of the cooled spherical shaped device;
- and
- transporting the spherical shaped device with the coat of ice on the outer surface.
A system for transporting a semiconductor device, the system comprising:
- a cooler for cooling the spherical shaped device;
- a moisture applicator for providing moisture to an outer surface of the cooled spherical shaped device to form a coat of ice thereon;
- and
- means for transporting the spherical shaped device with the coat of ice on the outer surface.
A tube system for transporting a spherical shaped semiconductor device, the system comprising:
- a first tube including a cooler for cooling the spherical shaped semiconductor device and a moisture applicator for providing moisture to an outer surface of the cooled spherical shaped semiconductor device to form a coat of ice thereon;
- a second tube for transporting the spherical shaped device with the coat of ice on the outer surface;
- and
- a third tube including a heater for heating the semiconductor device with the coat of ice after being transported, to convert the coat of ice to a moisture gas, and a condensing system for drawing the moisture gas from the semiconductor device.
Dependencies are inferred from the claim text.