Method for manufacturing magnetic head suspension assembly with head IC chip
AssigneeTDK Corporation
InventorsMasashi Shiraishi, Masanori Sakai, Tsuyoshi Umehara, Haruyuki Morita, Ken-ichi Takano
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Abstract
A method for manufacturing a magnetic head suspension assembly includes a step of forming a plurality of flexure pieces coupled with each other and kept substantially flat, each of the flexure pieces being provided with conductive connection pattern, a step of mounting head IC chips on the respective substantially flat flexure pieces, the mounting being executed before fixing of said flexure pieces to load beams, and a step of separating said flexure pieces with the head IC chips into individual pieces.
Claims28
A method for manufacturing a magnetic head suspension assembly comprising the steps of:
- forming a plurality of flexure, pieces coupled with each other and lying flat over their combined surfaces, each of said flexure pieces being provided with a conductive connection pattern;
- mounting, head IC chips on respective ones of the substantially flat flexure pieces, said mounting being executed before fixing of said flexure pieces to load beams;
- and
- separating said flexure pieces with the head IC chips into individual pieces.
A method for manufacturing a magnetic head suspension assembly comprising the steps of:
- forming a plurality of flexure-load beam pieces coupled with each other and lying flat over their combined surfaces, each of said flexure-load beam pieces-being-provided with a conductive connection pattern;
- mounting head IC chips on respective ones of the substantially flat flexure-load beam pieces, said mounting being executed before said flexure-load beam pieces are bent;
- and
- separating said flexure-load beam pieces with the head IC chips into individual pieces.
Dependencies are inferred from the claim text.