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US 6,199,563 B1Granted
Wafer processing apparatus, wafer processing method, and semiconductor substrate fabrication method
AssigneeCanon Kabushiki Kaisha
InventorsFumio Uehara, Kiyofumi Sakaguchi, Kazutaka Yanagita, Masakazu Harada
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Abstract
An ultrasonic bath (30) is arranged below a wafer processing bath (10). Wafers (40) are processed while ultrasonic waves are transmitted from the ultrasonic bath (30) to the wafer processing bath (10). The wafers (40) are processed while being entirely dipped into the wafer processing bath (10) and rotated by wafer rotating rods (53).
Claims23
A wafer processing apparatus for processing a wafer by dipping the wafer into a processing solution, comprising:
- a processing bath having a depth that allows to completely dip the wafer into the processing solution;
- a wafer rotating mechanism for rotating one or a plurality of wafers held by a wafer holder by using at least one rod member substantially parallel to and apart from an axis shifted from a portion below a barycenter of the one or plurality of wafers, said at least one rod member rotating about the axis;
- and
- an ultrasonic generator for generating ultrasonic waves in said processing bath.
1 more element
Dependencies are inferred from the claim text.