Sealing structure for organic light emitting devices
AssigneeeMagin Corporation
InventorsGary W. Jones, Webster E. Howard, Steven M. Zimmerman
Life of this patent
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Abstract
A sealing structure for an organic light emitting device display. The sealing structure comprises a metal film overlying a dielectric film. The sealing structure has low moisture and oxygen permeability. At least one of the metal layers may react with moisture or oxygen to seal off pin holes. A net low stress sealing structure may be formed by combining tensile and compressive films. The sealing structure may be etched to create openings for connection to outside circuitry. The innovative sealing structure minimizes moisture leakage and vertical shorts between diode cathode and anode.
Claims15
A display device comprising:
- an organic light emitting device, wherein said organic light emitting device includes a first conductor layer formed on a substrate, a plurality of organic layers formed on said first conductor layer, and a second conductor layer formed on said plurality of organic layers, said second conductor layer having an exposed surface;
- and
- a sealing structure formed on said exposed surface of said second conductor layer for sealing said organic light emitting device, wherein said sealing structure comprises a dielectric film formed directly on said exposed surface of said second conductor layer and a metal film formed directly on said dielectric film, wherein said dielectric film has a dielectric film exposed surface and said metal film is formed over and in contact with said entire dielectric film exposed surface, wherein said dielectric film includes at least one layer formed from a material selected from the group consisting of SiC, DLC, SiO, SiO2, Si3N4 and SiNxOy.
A display device comprising:
- a matrix comprising a plurality of organic light emitting devices, wherein each of said organic light emitting devices includes a first conductor layer formed on a substrate, a plurality of organic layers formed on said first conductor layer, and a second conductor layer formed on said plurality of organic layers, said second conductor layer having an exposed surface;
- a sealing structure formed on said exposed surface of said second conductor layer for sealing of said plurality of organic light emitting devices, wherein said sealing structure comprises a dielectric film formed directly on said exposed surface of said second conductor layer and a metal film formed directly on said dielectric film, wherein said dielectric film has a dielectric film exposed surface and said metal film is formed over and in contact with said entire dielectric film exposed surface, wherein said dielectric film includes at least one layer formed from a material selected from the group consisting of SiC, DLC, SiO, SiO2, Si3N4 and SiNxOy;
- and
- means for permitting direct contact between circuitry external to the matrix and said first and second conductors underlying the sealing structure.
A method for sealing an organic light emitting device having a top conductor layer having an exposed surface comprising the steps of:
- forming a dielectric film layer directly on the exposed surface of said top conductor layer of said organic light emitting device, wherein said dielectric film has a dielectric film exposed surface, wherein said dielectric film includes at least one layer formed from a material selected from the group consisting of SiC, DLC, SiO, SiO2, Si3N4 and SiNxOy;
- and
- forming a metal film layer directly on said dielectric film such that said metal film is formed over and in contact with said entire dielectric film exposed surface.
Dependencies are inferred from the claim text.