Method and apparatus for analyzing cuts
AssigneeInspectech Corporation
InventorsMichael Geffen, Abraham Ben-Har
Life of this patent
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Abstract
A system for analyzing the quality of the sawing of a material which includes a scanning unit, a cut parameter identifier and a cut analyzer. The scanning unit scans along cuts of the material and views at least a portion of a cut. The cut parameter identifier identifies and stores parameters of the viewed cut portion. The cut analyzer analyzes the parameters of a multiplicity of viewed cut portions and which determines the quality of the cuts therefrom.
Claims7
A system for analyzing the quality of the sawing of a material, the system comprising:
- scanning means which scans along cuts of said material and which views at least a portion of a cut;
- a cut parameter identifier which identifies and stores parameters of said viewed cut portion, said cut parameter identifier comprising:
- a kerf identifier which identifies upper and lower kerfs of said viewed cut portion;
- and
- a chip parameter identifier which identifies sawing chips along said upper and lower kerfs and determines parameters thereof;
- and
- a cut analyzer which analyzes said parameters of a multiplicity of viewed cut portions and which determines the quality of said cuts therefrom.
A method of identifying sawing chips, the method comprising the steps of:
- identifying upper and lower kerfs of a viewed cut section;
- identifying possible sawing chips along said upper and lower kerfs;
- determining chip parameters for each of said possible sawing chips;
- and
- marking said possible sawing chips as sawing chips or as non-chips based on the values of said chip parameters.
Dependencies are inferred from the claim text.