Encapsulation and enclosure of electronic modules

An electronic module, comprising:

• (a) an electrical assembly of a plurality of electrical components, wherein at least one electrical component of said electrical assembly of electrical components comprising at least a first integrated circuit and packaged in a package having at least one electrical lead electrically coupled to said integrated circuit and extending outward and away from said package and said electrical assembly of electrical components and at least one other electrical component which is not fabricated on the same semiconductor substrate as the semiconductor substrate on which said first integrated circuit has been fabricated;
• and
• (b) a cap surrounding a portion of said electrical assembly of electrical components to form a pocket between a portion of said electrical assembly of electrical components and said cap, said cap having at least one sidewall, each of said at least one sidewalls having an end, one of at least one sidewalls proximately positioned to said at least one electrical lead and having at least one notch positioned in said end, said pocket filled with an encapsulant.