Controlled low impedance high current circuit board interconnect

A low impedance high current interconnect for interfacing CIMs comprising:

• a first circuit board having a first mount pad and a second mount pad;
• a second circuit board having a third mount pad and a fourth mount pad;
• a first sheet member electrically interconnecting said first mount pad of said first circuit board to said third mount pad of said second circuit board, said first member for carrying a current to said first circuit board;
• a second sheet member mounted in close proximity and parallel to said first member, said second member electrically interconnecting said second mount pad of said first circuit board to said fourth mount pad of said second circuit board, said second member for carrying a current from said first circuit board;
• and
• a sheet insulator placed parallel to and between said first member and said second member providing a dielectric material between said first member and said second member to provide a low impedance high current interconnect between said first circuit board and said second circuit board.

A method for interconnecting CIMs with a low impedance high current path comprising the steps of:

• securing a first CIM to a first conductor and a conductive structure;
• securing a second CIM to said first conductor line and said conductive structure;
• and
• placing an insulative sheet between said first conductor and said conductive structure wherein said first conductor, said conductive structure and said insulative sheet are secured in close proximity in a parallel arrangement to provide a low impedance high current transmission line between said first CIM and said second CIM.