US 6,191,951 B1 · Smart card module and smart card including a smart card module

Abstract

A smart card module includes a semiconductor chip that is electrically conductively connected to a metallic lead frame in which contact areas are formed. The semiconductor chip and the contact areas are electrically conductively contacted through connection areas disposed on a surface of an electrically insulating protective layer applied to the semiconductor chip. That surface faces away from the semiconductor chip. Contact can be established between the connection areas and the contact areas through the use of soldered joints or electrically conductive adhesive bonds. A smart card including the smart card module is also provided.

Claims12

Dependent claims

A smart card module, comprising:

a semiconductor chip having sides;
an electrically insulating protective layer disposed on at least one of said sides of said semiconductor chip, said protective layer having a surface facing away from said semiconductor chip;
contact-making points disposed on said surface of said protective layer;
connection areas electrically conductively connected to said contact-making points;
and
a metallic lead frame receiving said semiconductor chip with said connection areas disposed at the front with said surface between said lead frame and said chip, said lead frame having contact areas electrically conductively contacting said connection areas.

3 more elements

Dependencies are inferred from the claim text.

Facts

Application

09/390,494Filed 3 Sep 1999 · continuation

Priority

DE 197 08 6173 Mar 1997

Granted

20 Feb 2001

Term ends

Not estimatedThe source records don’t support an estimate.

Classification6 codes

G06K 19/07747
Mounting details of integrated circuit chips: at least one of the integrated circuit chips being mounted as a module
G06K 19/07743
Constructional details, e.g. mounting of circuits in the carrier: external electrical contacts
H10W 72/07251
Of bump connectors: characterised by changes in properties of the bump connectors during connecting
H10W 72/20
Interconnections or connectors in packages: bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps

Smart card module and smart card including a smart card module

Life of this patent

Smart card module and smart card including a smart card module

Life of this patent

Abstract

Claims12