US 6,191,666 B1 · Miniaturized multi-layer ceramic lowpass filter · patentgrep

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Abstract

In a stripline configuration, a laminated lowpass filter circuit includes first through fifth dielectric substrates arranged in that order in a stack, first and second groundplane conductor layers disposed on the outer surfaces of the stack, and a shielding conductor layer formed on the third dielectric layer. First and second side electrodes are formed on sides of the stack. A stripline providing an inductive element is formed on the fourth dielectric layer, and first and second conductor plates providing capacitive elements are formed on the first and second dielectric layers. The terminal of the first conductor plate and a first end of the stripline are connected to the first side electrode. A terminal of the second conductor plate and a second end of the stripline are connected to the second side electrode. The first and second side electrodes constitute input and output terminals of the laminated lowpass filter circuit. The lowpass filter circuit can also be formed in a microstrip line configuration and a hybrid stripline and microstrip line configuration.

Claims12

Dependent claims

A laminated lowpass filter circuit comprising:

(a) a first dielectric substrate layer having substantially planar opposing surfaces;
(b) a first groundplane conductor layer disposed on a first one of said opposing surfaces;
(c) a first conductor plate comprising a capacitive element disposed on a second one of said opposing surfaces and having a terminal;
(d) a second dielectric substrate layer having substantially planar opposing surfaces with a first one of said opposing surfaces of said second dielectric substrate layer being disposed over said first conductor plate;
(e) a second conductor plate comprising a capacitive element disposed on a second one of said opposing surfaces of said second dielectric substrate layer and having a terminal;
(f) a third dielectric substrate layer having substantially planar opposing surfaces, with a first one of said opposing surfaces of said third dielectric substrate layer being disposed over said second conductor plate;
(g) a shielding conductor layer disposed over a second one of said opposing surfaces of said third dielectric substrate layer;
(h) a fourth dielectric substrate layer having substantially planar opposing surfaces, with a first one of said opposing surfaces of said fourth dielectric substrate layer being disposed over said shielding conductor layer;
(i) a stripline comprising an inductive element disposed on a second one of said opposing surfaces of said fourth dielectric substrate layer and having a first end and a second end;
(j) a fifth dielectric substrate layer having substantially planar opposing surfaces, with a first one of said opposing surfaces of said fifth dielectric substrate layer being disposed over said stripline;
(k) a second groundplane conductor layer disposed over a second one of said opposing surfaces of said fifth dielectric substrate layer, said first through fifth dielectric substrates, said first and second groundplane conductor layers and said shielding conductor layer being arranged in a stack;
and
(l) a first side electrode formed on a first side of said stack and a second side electrode formed on a second side of said stack, said terminal of said first conductor plate and said first end of said stripline being connected to said first side electrode, and said terminal of said second conductor plate and said second end of said stripline being connected to said second side electrode, and said first and second side electrodes constituting input and output terminals of said laminated lowpass filter circuit.

10 more elements

A laminated lowpass filter circuit comprising:

(a) a first dielectric substrate layer having substantially planar opposing surfaces;
(b) a first groundplane conductor layer disposed on a first one of said opposing surfaces;
(c) a first stripline comprising an inductive element disposed on a second one of said opposing surfaces of said first dielectric substrate layer and having a first end and a second end;
(d) a second dielectric substrate layer having substantially planar opposing surfaces with a first one of said opposing surfaces of said second dielectric substrate layer being disposed over said first stripline;
(e) a first shielding conductor layer disposed over a second one of said opposing surfaces of said second dielectric substrate layer;
(f) a third dielectric substrate layer having substantially planar opposing surfaces with a first one of said opposing surfaces of said third dielectric substrate layer being disposed over said first shielding conductor layer;
(g) a first conductor plate comprising a capacitive element disposed on a second one of said opposing surfaces of said third dielectric layer and having a terminal;
(h) a fourth dielectric substrate layer having substantially planar opposing surfaces with a first one of said opposing surfaces of said fourth dielectric substrate layer being disposed over said first conductor plate;
(i) a second conductor plate comprising a capacitive element disposed on a second one of said opposing surfaces of said fourth dielectric substrate layer and having a terminal;
(j) a fifth dielectric substrate layer having substantially planar opposing surfaces, with a first one of said opposing surfaces of said fifth dielectric substrate layer being disposed over said second conductor plate;
(k) a third conductor plate comprising a capacitive element disposed on a second one of said opposing surfaces of said fifth dielectric substrate layer and having a terminal;
(l) a sixth dielectric substrate layer having substantially planar opposing surfaces, with a first one of said opposing surfaces of said sixth dielectric substrate layer being disposed over said third conductor layer;
(m) a second shielding conductor layer disposed over a second one of said opposing surfaces of said sixth dielectric substrate layer;
(n) a seventh dielectric substrate layer having substantially planar opposing surfaces, with a first one of said opposing surfaces of said seventh dielectric substrate layer being disposed over said shielding conductor layer;
(o) a second stripline comprising an inductive element disposed on a second one of said opposing surfaces of said seventh dielectric substrate layer and having a first end and a second end;
(p) an eighth dielectric substrate layer having substantially planar opposing surfaces, with a first one of said opposing surfaces of said eighth dielectric substrate layer being disposed over said second stripline;
(q) a second groundplane conductor layer disposed over a second one of said opposing surfaces of said eighth dielectric substrate layer, said first through eighth dielectric substrates, said first and second groundplane conductor layers and said first and second shielding conductor layers being arranged in a stack;
and
(r) a first side electrode formed on a first side of said stack, a second side electrode formed on a second side of said stack, and a third side electrode formed on a third side of said stack, said terminal of said second conductor plate and said first end of said second stripline being connected to said first side electrode, said second terminal of said first stripline and said terminal of said third conductor layer being connected to said second side electrode, said first terminal of said first stripline, said terminal of said second conductor plate, and said second end of said second stripline being connected to said third side electrode, and said first and second side electrodes constituting input and output terminals of said laminated lowpass filter circuit.

16 more elements

A laminated lowpass filter circuit comprising:

(a) a first dielectric substrate layer having substantially planar opposing surfaces;
(b) a first groundplane conductor layer disposed on a first one of said opposing surfaces;
(c) a first conductor plate comprising a capacitive element disposed on a second one of said opposing surfaces and having a terminal;
(d) a second dielectric substrate layer having substantially planar opposing surfaces with a first one of said opposing surfaces of said second dielectric substrate layer being disposed over said first conductor plate;
(e) a second conductor plate comprising a capacitive element disposed on a second one of said opposing surfaces of said second dielectric substrate layer and having a terminal;
(f) a third dielectric substrate layer having substantially planar opposing surfaces, with a first one of said opposing surfaces of said third dielectric substrate layer being disposed over said second conductor plate;
(g) a third conductor plate comprising a capacitive element disposed on a second one of said opposing surfaces of said third dielectric substrate layer and having a terminal;
(h) a fourth dielectric substrate layer having substantially planar opposing surfaces, with a first one of said opposing surfaces of said fourth dielectric substrate layer being disposed over said third conductor plate;
(i) a shielding conductor layer disposed over a second one of said opposing surfaces of said fourth dielectric substrate layer;
(h) a fifth dielectric substrate layer having substantially planar opposing surfaces, with a first one of said opposing surfaces of said fifth dielectric substrate layer being disposed over said shielding conductor layer;
(i) a stripline comprising an inductive element disposed on a second one of said opposing surfaces of said fifth dielectric substrate layer and having a first end, a second end and a middle portion;
(j) a sixth dielectric substrate layer having substantially planar opposing surfaces, with a first one of said opposing surfaces of said sixth dielectric substrate layer being disposed over said stripline;
(k) a second groundplane conductor layer disposed over a second one of said opposing surfaces of said sixth dielectric substrate layer, said first through sixth dielectric substrates, said first and second groundplane conductor layers and said shielding conductor layer being arranged in a stack;
and
(l) a first side electrode formed on a first side of said stack, a second side electrode formed on a second side of said stack, and a third side electrode formed on a third side of said stack, said terminal of said second conductor plate and said first end of said stripline being connected to said first side electrode, said terminal of said third conductor plate and said second end of said stripline being connected to said second side electrode, said terminal of said first conductor plate and said middle portion of said stripline being connected to said third side electrode, and said first and second side electrodes constituting input and output terminals of said laminated lowpass filter circuit.

12 more elements

A laminated lowpass filter circuit comprising:

(a) a first dielectric substrate layer having substantially planar opposing surfaces;
(b) a first groundplane conductor layer disposed on a first one of said opposing surfaces;
(c) a first conductor plate comprising a capacitive element disposed on a second one of said opposing surfaces and having first and second terminals;
(d) a second dielectric substrate layer having substantially planar opposing surfaces with a first one of said opposing surfaces of said second dielectric substrate layer being disposed over said first conductor plate;
(e) a second conductor plate comprising a capacitive element disposed on a second one of said opposing surfaces of said second dielectric substrate layer and having a terminal;
(f) a third dielectric substrate layer having substantially planar opposing surfaces, with a first one of said opposing surfaces of said third dielectric substrate layer being disposed over said second conductor plate;
(g) a third conductor plate comprising a capacitive element disposed on a second one of said opposing surfaces of said third dielectric substrate layer and having a terminal;
(h) a fourth dielectric substrate layer having substantially planar opposing surfaces, with a first one of said opposing surfaces of said fourth dielectric substrate layer being disposed over said third conductor plate;
(i) a shielding conductor layer disposed over a second one of said opposing surfaces of said fourth dielectric substrate layer;
(j) a fifth dielectric substrate layer having substantially planar opposing surfaces, with a first one of said opposing surfaces of said fifth dielectric substrate layer being disposed over said shielding conductor layer;
(k) a first stripline comprising an inductive element disposed on a second one of said opposing surfaces of said fifth dielectric substrate layer and having a first end and a second end;
(l) a second stripline comprising an inductive element disposed on said second one of said opposing surfaces of said fifth dielectric substrate layer and having a first end and a second end;
(m) a sixth dielectric substrate layer having substantially planar opposing surfaces, with a first one of said opposing surfaces of said sixth dielectric substrate layer being disposed over said first and second striplines;
(n) a second groundplane conductor layer disposed over a second one of said opposing surfaces of said sixth dielectric substrate layer, said first through sixth dielectric substrates, said first and second groundplane conductor layers and said shielding conductor layer being arranged in a stack;
and
(o) a first side electrode formed on a first side of said stack, a second side electrode formed on a second side of said stack, a third side electrode formed on a third side of said stack, and a fourth side electrode formed on a fourth side of said stack, said terminal of said second conductor plate and said first end of said first stripline being connected to said first side electrode, said terminal of said third conductor plate and said second end of said second stripline being connected to said second side electrode, said first terminal of said first conductor plate and said second end of said first stripline being connected to said third side electrode, said second terminal of said first conductor plate and said first end of said second stripline being connected to said fourth side electrode, and said first and second side electrodes constituting input and output terminals of said laminated lowpass filter circuit.

13 more elements

A laminated lowpass filter circuit comprising:

(a) a first dielectric substrate layer having substantially planar opposing surfaces;
(b) a first groundplane conductor layer disposed on a first one of said opposing surfaces;
(c) a first conductor plate comprising a capacitive element disposed on a second one of said opposing surfaces and having first and second terminals;
(d) a second dielectric substrate layer having substantially planar opposing surfaces with a first one of said opposing surfaces of said second dielectric substrate layer being disposed over said first conductor plate;
(e) a second conductor plate comprising a capacitive element disposed on a second one of said opposing surfaces of said second dielectric substrate layer and having a terminal;
(f) a third conductor plate comprising a capacitive element disposed on said second one of said opposing surfaces of said second dielectric substrate layer and having a terminal;
(g) a third dielectric substrate layer having substantially planar opposing surfaces, with a first one of said opposing surfaces of said third dielectric substrate layer being disposed over said second and third conductor plates;
(h) a shielding conductor layer disposed over a second one of said opposing surfaces of said third dielectric substrate layer;
(i) a fourth dielectric substrate layer having substantially planar opposing surfaces, with a first one of said opposing surfaces of said fourth dielectric substrate layer being disposed over said shielding conductor layer;
(j) a first stripline comprising an inductive element disposed on a second one of said opposing surfaces of said fourth dielectric substrate layer and having a first end and a second end;
(k) a second stripline comprising an inductive element disposed on said second one of said opposing surfaces of said fourth dielectric substrate layer and having a first end and a second end;
(l) a fifth dielectric substrate layer having substantially planar opposing surfaces, with a first one of said opposing surfaces of said fifth dielectric substrate layer being disposed over said first and second striplines;
(m) a second groundplane conductor layer disposed over a second one of said opposing surfaces of said fifth dielectric substrate layer, said first through fifth dielectric substrates, said first and second groundplane conductor layers and said shielding conductor layer being arranged in a stack;
and
(n) a first side electrode formed on a first side of said stack, a second side electrode formed on a second side of said stack, a third side electrode formed on a third side of said stack, and a fourth side electrode formed on a fourth side of said stack, said terminal of said second conductor plate and said first end of said first stripline being connected to said first side electrode, said terminal of said third conductor plate and said second end of said second stripline being connected to said second side electrode, said first terminal of said first conductor plate and said second end of said first stripline being connected to said third side electrode, said second terminal of said first conductor plate and a first end of said second stripline being connected to said fourth side electrode, and said first and second side electrodes constituting input and output terminals of said laminated lowpass filter circuit.

12 more elements

A laminated lowpass filter circuit comprising:

(a) a first dielectric substrate layer having substantially planar opposing surfaces;
(b) a first groundplane conductor layer disposed on a first one of said opposing surfaces;
(c) a first conductor plate comprising a capacitive element disposed on a second one of said opposing surfaces and having a terminal;
(d) a second dielectric substrate layer having substantially planar opposing surfaces with a first one of said opposing surfaces of said second dielectric substrate layer being disposed over said first conductor plate;
(e) a second conductor plate comprising a capacitive element disposed on a second one of said opposing surfaces of said second dielectric substrate layer and having first and second terminals;
(f) a third dielectric substrate layer having substantially planar opposing surfaces, with a first one of said opposing surfaces of said third dielectric substrate layer being disposed over said second conductor plate;
(g) a third conductor plate comprising a capacitive element disposed on a second one of said opposing surfaces of said third dielectric substrate layer and having a terminal;
(h) a fourth dielectric substrate layer having substantially planar opposing surfaces, with a first one of said opposing surfaces of said fourth dielectric substrate layer being disposed over said third conductor plate;
(i) a shielding conductor layer disposed over a second one of said opposing surfaces of said fourth dielectric substrate layer;
(j) a fifth dielectric substrate layer having substantially planar opposing surfaces, with a first one of said opposing surfaces of said fifth dielectric substrate layer being disposed over said shielding conductor layer;
(k) a first stripline comprising an inductive element disposed on a second one of said opposing surfaces of said fifth dielectric substrate layer and having a first end and a second end;
(l) a second stripline comprising an inductive element disposed on said second one of said opposing surfaces of said fifth dielectric substrate layer and having a first end and a second end;
(m) a sixth dielectric substrate layer having substantially planar opposing surfaces, with a first one of said opposing surfaces of said sixth dielectric substrate layer being disposed over said first and second striplines;
(n) a second groundplane conductor layer disposed over a second one of said opposing surfaces of said sixth dielectric substrate layer, said first through sixth dielectric substrates, said first and second groundplane conductor layers and said shielding conductor layer being arranged in a stack;
and
(o) a first side electrode formed on a first side of said stack, a second side electrode formed on a second side of said stack, a third side electrode formed on a third side of said stack, and a fourth side electrode formed on a fourth side of said stack, said terminal of said third conductor plate and said first end of said first stripline being connected to said first side electrode, said terminal of said first conductor plate and said second end of said second stripline being connected to said second side electrode, said first terminal of said second conductor plate and said second end of said first stripline being connected to said third side electrode, said second terminal of said second conductor plate and said first end of said second stripline being connected to said fourth side electrode, and said first and second side electrodes constituting input and output terminals of said laminated lowpass filter circuit.

13 more elements

Dependencies are inferred from the claim text.

Facts

Application: 09/275,945Filed 25 Mar 1999
Granted: 20 Feb 2001
Term ends: Not estimatedThe source records don’t support an estimate.

Classification6 codes

H03H 7/0123
Frequency selective two-port networks: comprising distributed impedance elements together with lumped impedance elements
H03H 7/0115
Frequency selective two-port networks: comprising only inductors and capacitors
H03H 7/1758
Comprising typical LC combinations, irrespective of presence and location of additional resistors: series LC in shunt or branch path
H03H 7/1766
Comprising typical LC combinations, irrespective of presence and location of additional resistors: parallel LC in series path

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