Integrated circuit testing device

An integrated circuit testing device for testing an integrated circuit, comprising:

• a flexible base of an insulating material, the base having a first surface and a second surface opposite each other, the integrated circuit having a bottom surface bonded to the first surface;
• a conductive wiring layer provided on the first or second surface of the base, the wiring layer including a plurality of projecting contact over the first surface at positions which electrodes of the integrated circuit are connected to;
• and
• an elastic member provided beneath the second surface of the base opposite the first surface, the elastic member fully extending, without interruption, beneath the entire bottom surface of the integrated circuit including the positions where the electrodes are provided, the elastic member including a plurality of elastic member layers beneath the second surface of the base, and one of the plurality of elastic member layers, that is nearest to the base, having physical properties different from physical properties of the other elastic member layers.

A method of testing an integrated circuit by using an integrated circuit testing device,

• the testing device including:
• a flexible base of an insulating material, the base having a first surface and a second surface opposite each other, the integrated circuit having a bottom surface bonded to the first surface;
• a conductive wiring layer provided on the first or second surface of the base, the wiring layer including a plurality of projecting contacts over the firs surface at positions which electrodes of the integrated circuit are connected to;
• an elastic member provided beneath the second surface of the base opposite the first surface, the elastic member fully extending, without interruption, beneath the entire bottom surface of the integrated circuit including the positions where the electrodes are provided, the elastic member having a first level of hardness;
• and a flexible film member provided between the second surface of the base and the elastic member, the film member having a second level of hardness higher than the first level of hardness of the elastic member, said method comprising the steps of:
• positioning the integrated circuit to the testing device so that the positions of the electrodes on the integrated circuit match the positions of the contacts on the wiring layer;
• applying a downward pressure to the integrated circuit so that the integrated circuit is face-down bonded to the testing device, the electrodes being pressed onto the contacts of the testing device to establish electrical connections between the contacts and the electrodes;
• and
• electrically testing the integrated circuit by using said testing device, the film member, provided between the second surface of the base and the elastic member, acting to absorb a pressure exerted on the integrated circuit during the testing.

A method of testing an integrated circuit by using an integrated circuit testing device, the testing device including:

• a flexible base of an insulating material, the base having a first surface and a second surface opposite each other, the integrated circuit having a bottom surface bonded to the first surface;
• a conductive wiring layer provided on the first or second surface of the base, the wiring layer including a plurality of projecting contacts over the first surface at positions which electrodes of the integrated circuit are connected to;
• and an elastic member provided beneath the second surface of the base opposite the first surface, the elastic member fully extending, without interruption, beneath the entire bottom surface of the integrated circuit including the positions where the electrodes are provided, the elastic member including a plurality of elastic member layers beneath the second surface of the base, and one or the plurality of elastic member layers, that is nearest to the base, having physical properties different from physical properties of the other elastic member layers, said method comprising the steps of:
• positioning the integrated circuit to the testing device so that the positions of the electrodes on the integrated circuit match the positions of the contacts on the wiring layer;
• applying a downward pressure to the integrated circuit so that the integrated circuit is face-down bonded to the testing device, the electrodes being pressed onto the contacts of the testing device to establish electrical connections between the contacts and the electrodes;
• and
• electrically testing the integrated circuit by using said testing device, the elastic member, provided beneath the second surface of the base opposite to the first surface, acting to absorb a pressure exerted on the integrated circuit during the testing.