Semiconductor device and method of producing the same

A semiconductor device comprising:

• a semiconductor chip;
• a resin package which seals the semiconductor chip;
• signal passages which guide signal terminals of the semiconductor chip outward from the resin package;
• signal terminals formed on first protrusions of the resin package and connected to the signal passages;
• a grounding metal film on a second protrusion of the semiconductor chip, said second protrusion having an area wider than that of the semiconductor chip;
• and
• a grounding passage connected to the grounding metal film and guided outward from the resin package.