Semiconductor package having a separated die pad

Abstract

This invention relates to a semiconductor package having a separated die pad, which is comprised of an integrated circuit chip having a plurality or bonding pads mounted on its surface; a die pad providing its upper surface for the chip to be attached to, which comprises the first plate and second plates disposed a space apart, and an adhesive film attached to the under surface of the first and second plates; a plurality of leads, the near end portions of the leads which can be electrically connected to the bonding pads of the chip, wherein the far end portions are exposed to the exterior surface of the semiconductor package; and a package body made of insulating material, wherein the chip, the die pad and the leads including parts of their near end portions are encapsulated. Such semiconductor package having a separated die pad is capable of reducing the material used to make the die pad, providing better stress absorption, and effectively preventing the chip and the die pad from resulting in crack and delamination, while by means of using adhesive film, preventing the silver paste which attaches the chip to the die pad from bleeding downwards.

Dependencies are inferred from the claim text.