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AssigneeMicronas GmbH
InventorsGünter Igel, Hans-Jürgen Gahle, Mirko Lehmann
Estimating the term…
A process is provided for manufacturing a layer arrangement (1) having a bump for a flip chip or similar connection. The layer arrangement has a plurality of layers (2, 3, 4, 5, 6, 7, 11) made of solid material and stacked into a layer stack (8). A recess (10) that extends over several layers (2, 3, 4, 5, 6, 7, 11) is made in the layer stack (8) transverse to the coating planes of the layers (2, 3, 4, 5, 6, 7, 11). A bump material (14) is placed in the recess (10). A profiling is created on the lateral boundary wall of the recess (10) by removal of layer material of different layers (2, 3, 4, 5, 6, 7, 11) of the layer stack (8). The profiling, starting from the surface (9) of the layer stack (8) and progressing in layers to the inside of the recess (10), has at least two indentations (12) and at least one projection (13) located between them. After the production of the profiling, a bump material (14) is brought into the recess (10) in such a way that it grasps behind the indentations (12).
A layer arrangement (1) comprising a layer stack (8) having a plurality of layers (2, 3, 4, 5, 6, 7, 11) made of solid material, a recess (10) extending transverse to coating planes of the layers (2, 3, 4, 5, 6, 7, 11), a bump arranged in the recess (10), the bump being made of a continuous, single-piece bump material (14), wherein the recess (10) extends across several layers (2, 3, 4, 5, 6, 7, 11) of the layer stack (8), wherein a lateral boundary wall of the recess (10) has at least one profiling that, progressing layer-wise from a surface (9) of the layer stack (8) bordering the recess (10) to an interior of the recess (10), has at least two indentations (12) and at least one projection (13) located therebetween, and wherein the bump grasps behind the indentations (12).
Dependencies are inferred from the claim text.