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US 6,191,488 B1Granted
Flip chip type semiconductor package and method of injecting resin into device thereof
AssigneeOki Electric Industry Co., Ltd.
InventorTadashi Inuzuka
Life of this patent
Estimating the term…
Abstract
A semiconductor package including a sealing resin between a substrate and a semiconductor chip, wherein a concavity portion is defined in the surface of the substrate. The concavity facilitates spreading of the resin when the latter is injected between the substrate and the chip to connect them in a sealed manner.
Claims19
A semiconductor device, comprising:
- a substrate having interconnections formed on a principal surface, the interconnections including a plurality of connecting portions, and a plurality of external connecting terminals formed on another principal surface, the external connecting terminals being electrically connected to the interconnections through a plurality of through holes;
- a semiconductor chip having a plurality of input/output terminals, said semiconductor chip mounted on the principal surface of the substrate so that the input/output terminals are connected to the interconnections;
- and
- a sealing material for sealing between said substrate and said semiconductor chip;
- wherein a concave portion is defined in the principal surface of said substrate and said sealing material is charged within the concave portion.
2 more elements
A semiconductor device comprising:
- a substrate having a main surface and a back surface, said substrate having a concave portion in a central area of said main surface, said substrate including a plurality of pads formed in a peripheral area of said main surface, a plurality of connecting portions of said substrate being formed on said back surface, and a plurality of conductive portions respectively electrically connecting the connecting portions to the pads;
- a semiconductor chip having a plurality of electrodes each outputting an electric signal, said semiconductor chip being formed on said main surface of said substrate, wherein said electrodes are respectively electrically connected to said pads of said substrate;
- and
- a sealing resin provided between said substrate and said semiconductor chip so that said sealing resin covers said electrodes, said pads and said concave portion of said substrate.
1 more element
A method of manufacturing a semiconductor device comprising the steps of:
- providing a semiconductor chip having a plurality of electrodes;
- providing a substrate having a main surface and a back surface, including forming the substrate with a concave portion in a central area of the main surface, a plurality of pads in a peripheral area of the main surface, a plurality of connecting portions on the back surface, and a plurality of conductive portions respectively electrically connecting the connecting portions to the pads;
- mounting the chip on the substrate main surface, including respectively connecting the electrodes to the pads;
- and
- injecting a sealing material between the substrate and the chip so that the sealing material covers the electrodes, the pads and the concave portion of the substrate.
2 more elements
Dependencies are inferred from the claim text.