Universal land grid array socket engagement mechanism

A semiconductor package assembly comprising:

• a land grid array socket;
• a land grid array module having a substantially flat carrier member having electrical contact with said socket, said carrier member also including a semiconductor die disposed on top of said carrier member so as to leave exposed a top portion of said carrier member on opposite sides of said die;
• a support frame structure affixed to a printed circuit card to which said socket is attached for electrical connection, said support frame having hinge support members also disposed on said same opposite die sides,
• at least two pressure rails supported by arms disposed said hinge members, said pressure rails being disposed so as to be pivotally urgable against said exposed top carrier portion on opposite sides of said semiconductor die;
• flexible arms exposed through said hinge support members and pivotally attached to said pressure rails so as to be movable against respective ones of said carrier top portions;
• and
• means for lockably engaging said arms at the end of their pivotal motion.