Ball grid array semiconductor package and method of fabricating the same
AssigneeLG Semicon Co., Ltd.
InventorSung Ho Oh
Life of this patent
Estimating the term…
Abstract
A ball grid array semiconductor package includes a first substrate having a plurality of first holes and a recess, a second substrate having a plurality of second holes and a third hole, a plurality of conductive balls connecting the first and second substrates by filling the first and second holes, a semiconductor chip on the recess of the first substrate, a first conductive wiring portion electrically connecting the semiconductor chip and the conductive balls, and an encapsulating member encapsulating the semiconductor chip.
Claims27
A ball grid array semiconductor package, comprising:
- a first substrate having a plurality of first holes and a recess;
- a second substrate having a plurality of second holes and a third hole;
- a plurality of conductive balls connecting the first and second substrates by filling the first and second holes;
- a semiconductor chip on the recess of the first substrate;
- a first conductive wiring portion electrically connecting the semiconductor chip and the conductive balls;
- and
- an encapsulating member encapsulating the semiconductor chip, so that a top surface of the semiconductor chip is substantially completely covered with the encapsulating member.
A stackable ball grid array semiconductor package, comprising:
- a first substrate having a plurality of first holes and a first recess;
- a second substrate having a plurality of second holes and a third hole;
- a plurality of first conductive balls filling the first and second holes;
- a first semiconductor chip on the first recess;
- a first conductive wiring portion electrically connecting the first semiconductor chip and the first conductive balls;
- a first encapsulating member encapsulating the first semiconductor chip;
- a third substrate having a plurality of fourth holes and a second recess;
- a fourth substrate having a plurality of fifth holes and sixth a hole;
- a plurality of second conductive balls filling the third and fourth holes, the first and second conductive balls being electrically connected each other;
- a second semiconductor chip on the second recess;
- a second conductive wiring portion electrically connecting the second semiconductor chip and the second conductive balls;
- and
- a second encapsulating member encapsulating the second semiconductor chip.
A method of fabricating a ball grid array semiconductor package, the method comprising the steps of:
- preparing first and second substrates, the first substrate having a plurality of first holes and a first recess, and the second substrate having a plurality of second holes and a third hole;
- attaching a first semiconductor chip on the first recess of the first substrate;
- electrically connecting the first semiconductor chip to a first conductive wiring portion;
- encapsulating the first semiconductor chip using a first encapsulating member, so that a top surface of the first semiconductor chip is substantially completely covered with the first encapsulating member;
- mounting a plurality of first conductive balls on the first and second substrates through the first holes;
- and
- bonding the first and second substrates to form a first semiconductor package.
Dependencies are inferred from the claim text.