Cleaning composition and method for removing residues
AssigneeArch Specialty Chemicals, Inc.
InventorsVincent G. Leon, Kenji Honda, Eugene F. Rothgery
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Abstract
Non-corrosive cleaning compositions that are aqueous based and useful for removing photoresist, plasma etch and CMP residues from a substrate. One preferred cleaning composition comprises: (i) a hydroxylamine or a hydroxylamine salt compound; (ii) at least one fluorine-containing compound; and (iii) water. Another cleaning composition comprises: (i) a compound selected from the group consisting of: an amine, a quatenary ammonium hydroxide, and ammonium hydroxide; (ii) at least one fluorine-containing compound; and (iii) water.
Claims6
A method for removing residues from a substrate comprising the step of contacting a residue-containing substrate with a cleaning composition comprising (i) a hydroxylamine salt compound selected from the group consisting of hydroxylammonium sulfate, hydroxylammonium nitrate, hydroxylammonium phosphate, hydroxylammonium oxalate, hydroxylammonium citrate, and hydroxylammonium chloride;
- (ii) at least one fluorine-containing compound;
- and (iii) water.
A method for removing residues from a substrate comprising the step of contacting a residue-containing substrate with a cleaning composition comprising (i) a compound selected from the group consisting of:
- trimethyl hydroxyethylammonium hydroxide, methyl tri (hydroxyethyl) ammonium hydroxide, tetra(hydroxyethyl)ammonium hydroxide, diethylene glycolamine, and N-hydroxylethylpiperazine;
- (ii) at least one fluorine-containing compound;
- and (iii) water.
Dependencies are inferred from the claim text.