Wafer surface treatment methods and systems using electrocapillarity

A planarization method comprising:

• providing a substrate assembly having a surface;
• providing a liquid adjacent the surface resulting in an interface therebetween;
• planarizing the surface of the substrate assembly using the liquid;
• altering a planarization rate of the surface of the substrate assembly by applying an electrical potential difference across the interface to create at least one region of net charge of a first polarity within the substrate assembly at a location along the interface and at least one region of net charge of a polarity opposite the first polarity in the liquid at the location along the interface, wherein the formation of the first and second regions of net charge results in a change in the interfacial tension at the location along the interface between the liquid and the surface of the substrate assembly.

A surface treatment method for use in integrated circuit fabrication, the method comprising:

• providing a substrate assembly having a surface;
• providing a liquid adjacent the surface resulting in an interface between the surface and the liquid;
• applying an electrical potential difference across the interface such that at least one region of net charge of a first polarity forms within the substrate assembly at the interface and at least one region of net charge of a polarity opposite the first polarity forms in the liquid at the interface to control interfacial tension at the interface between the surface and the liquid;
• and
• treating the surface as the electrical potential difference is applied across the interface.

A planarization apparatus comprising:

• a planarization element;
• a holder for supporting a substrate assembly having a surface, the holder being positionable for disposing the substrate assembly supported in the holder relative to the planarization element;
• a dispensing device for providing a liquid planarization composition adjacent the surface resulting in an interface between the liquid planarization composition and the surface;
• and
• a power source connected to a number of electrodes to apply an electrical potential difference across the interface as the substrate assembly is disposed relative to the planarization element such that at least one region of net charge of a first polarity forms within the substrate assembly at the interface and at least one region of net charge of a polarity opposite the first polarity forms in the liquid planarization composition at the interface.

A coating apparatus comprising:

• a rotatable coating platform for supporting a substrate assembly having a surface;
• a dispensing device for introducing a liquid coating material at the surface of the substrate assembly resulting in an interface therebetween;
• and
• a power source operatively connected to at least one electrode to apply an electrical potential difference across the interface to control interfacial tension at the interface.