Apparatus and method for chemical/mechanical polishing
AssigneeMatsushita Electronics Corporation
InventorsHideaki Yoshida, Masashi Hamanaka
Life of this patent
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Abstract
A polishing pad is fixed on a polishing platen mounted to be rotatable. An abrasive supply tube supplies an abrasive onto the polishing pad. A substrate holder is mounted to be rotatable above the polishing pad, holds a substrate to be polished and presses the substrate against the polishing pad, thereby polishing the substrate. A dresser is mounted to be rotatable above the polishing pad, and dresses the polishing pad. A torque detector detects the rotation torque of the polishing platen or the rotation torque of the substrate holder. A dresser controller makes the dresser dress the polishing pad if the rotation torque detected by the torque detector is equal to or smaller than a predetermined value.
Claims6
A chemical/mechanical polishing method comprising the steps of:
- a) rotating a substrate holder, which holds a substrate thereon, with an abrasive supplied onto a polishing pad fixed on a rotating polishing platen, bringing the substrate down to be closer to the polishing pad, and then pressing the substrate against the polishing pad, thereby polishing the substrate;
- b) detecting at least one of the rotation torque of the polishing platen and the rotation torque of the substrate holder;
- and
- c) dressing the polishing pad if the rotation torque detected in the step b) is equal to or smaller than a first rotational torque value.
A chemical/mechanical polishing method comprising the steps of:
- a) rotating a substrate holder, which holds a substrate thereon, with an abrasive supplied onto a polishing pad fixed on a rotating polishing platen, bringing the substrate down to be closer to the polishing pad, and then pressing the substrate against the polishing pad, thereby polishing the substrate;
- b) dressing the polishing pad by pressing a rotating dresser against the polishing pad;
- c) detecting at least one of the rotation torque of the polishing platen, the rotation torque of the substrate holder and the rotation torque of the dresser;
- and
- d) increasing at least one of processing parameters including revolving speed of the dresser, pressure of the dresser against the polishing pad and amount of time during which the dresser dresses the polishing pad if the rotation torque detected in the step c) is smaller than a first rotational torque value.
Dependencies are inferred from the claim text.