Method for fabricating metal oxide semiconductor
AssigneeUnited Microelectronics Corp.
InventorsTony Lin, Jih-Wen Chou
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AssigneeUnited Microelectronics Corp.
InventorsTony Lin, Jih-Wen Chou
Estimating the term…
A method of for fabrication a metal oxide semiconductor transistor is described. A substrate with an isolation structure thereon is provided. A gate oxide layer is formed on the substrate. A polysilicon layer is formed on the gate oxide layer. The polysilicon layer is patterned to form a gate on the gate oxide layer. An offset spacer is formed on the sidewall of the gate. A source/drain extension is formed in the substrate on two sides of the gate by ion implantation. An insulating spacer is formed on the sidewall of the offset spacer. A source/drain region is formed in the substrate by ion implantation using the gate, the offset spacer and the insulating spacer as a mask. Salicide is formed on the gate and on the surface of the source/drain region. After forming the salicide, the offset spacer is removed. After removing the offset spacer, a halo doped region is formed in the substrate below the source/drain extension by ion implantation.
A method forming a metal oxide semiconductor transistor, the method comprising:
A method for forming a metal oxide semiconductor transistor, which method is performed on a substrate comprising a gate thereon, comprising the steps of:
A method for forming a halo doped region, which method is performed on a substrate comprising at least a gate thereon, comprising the steps of:
Dependencies are inferred from the claim text.