Fabricating method of semiconductor package
AssigneeHyundai Electronics Industries Co., Ltd.
InventorMyeong-Jin Shin
Life of this patent
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Abstract
A method of forming a semiconductor package that includes at least one structure having a central hole formed at a center portion of the structure, a plurality of outer holes around the center hole, and a plurality of conductor pieces buried in the outer holes; at least one TAB having lead lines extending from sides of the TAB, the TAB having a configuration substantially corresponding to the central hole of the structure and formed over the central hole of the structure; and a molding material covering at least a portion of the TAB.
Claims16
A method for fabricating a semiconductor package comprising the steps of:
- providing a structure according to a shape of a package;
- attaching lead lines on a fixture and extending in four directions to form a TAB;
- forming holes in regular intervals in the structure;
- burying a piece of conductor in each of the holes;
- reflowing the lead lines on the TAB for electrical connection of the lead lines to respective pieces of conductor and attachment of the lead lines to the structure.
A method of fabricating a tape automated bonding (TAB) type semiconductor device, comprising:
- forming a structure with a central opening, and a plurality of peripheral openings;
- forming a plurality of conductors in the peripheral openings;
- providing a cover with lead lines extending therefrom in different directions;
- and
- connecting the cover to the structure with the central opening having a semiconductor device therein, the lead lines and the conductors being electrically connected.
Dependencies are inferred from the claim text.