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US 6,190,945 B1Granted
Integrated heat sink
AssigneeMicron Technology, Inc.
InventorSalman Akram
Life of this patent
Estimating the term…
Abstract
A semiconductor device has an integrated heat sink. A package body encapsulates a die and a leadframe. A heat sink is in thermal contact with the die and the leadframe. The heat sink is encapsulated in the package body. The heat sink has a connector (e.g., a threaded connection, a conductive adhesive layer) for attachment to an external heat
Claims7
A method of forming an integrated circuit package containing a semiconductor die comprising:
- encapsulating the semiconductor die together with an internal heat sink;
- and
- connecting an external heat sink to the internal heat sink.
Dependencies are inferred from the claim text.