Stacked package for semiconductor device and fabrication method thereof, and apparatus for making the stacked package

A method for fabricating a stacked semiconductor package, comprising the steps of:

• preparing a jig for package aligning including a substrate consisting of an insulating body having a predetermined height, a plurality of cavities formed at an upper portion of the body, through holes respectively formed in the cavities and penetrating the body, and align poles disposed at marginal portions of both sides of the body, and an align mask having a mask body, a plurality of openings penetrating the mask body and align holes formed in each corner of marginal portions of the mask body, wherein the align mask is attached on an upper surface of the substrate;
• placing a first-type package in each cavity, the first-type package including a semiconductor chip having a plurality of pads on a center portion of an upper surface thereof, leads of which end portions are attached on the upper surface of the semiconductor chip at outer sides of the pads and the other end portions are externally extended from the semiconductor chip, wires for connecting the ends portions of the leads to the corresponding pads, and a molding portion covering the semiconductor chip, the wires and portions of the leads;
• preparing a second-type package consisting of a semiconductor chip having a plurality of pads on a center portion of a lower surface thereof, leads each of which consists of a chip-attached portion, a substrate-attached portion and a connecting portion and is formed in a ‘S’ shape, top surfaces of the chip-attached portions of the leads being respectively attached to portions of the lower surface of the semiconductor chip at the outer sides of the pads, wires for connecting end portions of the chip-attached portions to the corresponding pads, and a molding portion covering the semiconductor chip, the pads, the wires, and the chip-attached portions and the connecting portions of the leads;
• attaching a plurality of solder balls to the lower surfaces of the substrate-attached portions of the leads of the second-type package;
• mounting the second-type package on the first-type package disposed in each opening of the jig for the package aligning;
• and
• reflowing for the solder balls.