Method of fabricating a circuit arrangement with thermal vias
AssigneeDaimlerChrysler AG
InventorsHelmut Heinz, Bernhard Schuch
Life of this patent
Estimating the term…
Abstract
An electronic component is mounted on a substrate such as a circuit board by means of a soldering process such as reflow soldering. The circuit board has a thermal via hole therethrough to provide a heat dissipation path from the top surface to the bottom surface of the circuit board, for dissipating heat from the electronic component. To prevent molten solder from penetrating through the via hole during the soldering process, the via hole is sealed prior to the soldering process. The via hole is sealed from the bottom surface of the substrate by carrying out a screen printing process including at least two printing passes to print a sealing material into the open hole of the thermal via.
Claims19
A method of fabricating a circuit arrangement comprising the following steps:
- a) providing a supporting substrate having a first surface on a first side thereof and a second surface on a second side thereof and a through-hole passing through said substrate between said first and second surfaces;
- b) closing an opening of said through-hole in said second surface by screen printing a screen printing material into said opening from said second side of said substrate, wherein said screen printing includes at least two printing passes;
- and
- c) after said step b), soldering a component onto said first surface of said substrate.
Dependencies are inferred from the claim text.