Low-cost, high-density light-emitting-diode array and fabrication method thereof

A method of fabricating a light-emitting diode array on a substrate having a lower layer and a semiconducting upper layer formed on said lower layer, said method comprising the steps of:

• selectively diffusing an impurity into said upper layer from an upper surface of said upper layer to a depth less then a thickness of said upper layer, thereby creating a row of light-emitting diodes having respective pn junctions in said upper layer;
• forming isolation channels extending from said upper surface of said upper layer to said lower layer, thereby dividing said upper layer into a plurality of blocks that are electrically isolated from one another, each of said plurality of blocks including a plurality of said light-emitting diodes;
• forming a block electrode in each of said plurality of blocks, electrically coupled to said upper layer within the respective block, for driving the light-emitting diodes in the respective block;
• forming a plurality of shared lines disposed in parallel to said row of light-emitting diodes and crossing said isolation channels, each of said shared lines being electrically coupled to a plurality of said light-emitting diodes in different ones of said plurality of blocks, and each light-emitting diode in said row of light-emitting diodes being electrically coupled to one shared line among said plurality of shared lines;
• forming a first inter-layer insulating film on said upper layer;
• forming openings extending through said first inter-layer insulating film to said light-emitting diodes;
• forming individual lines on said first inter-layer insulating film, contacting respective light-emitting diodes through said openings;
• forming a second inter-layer insulating film on said first inter-layer insulating film, covering said individual lines;
• forming via holes extending through said second inter-layer insulating film to said individual lines;
• wherein said shared lines are formed on said second inter-layer insulating film, and are connected to said individual lines through said via holed in said second inter-layer insulating film, thus being electrically coupled to said light-emitting diodes;
• sintering a block electrode in each of said plurality of blocks;
• sintering said individual lines;
• wherein said step of forming isolation channels is carried out after said steps of sintering the block electrode in each of said plurality of blocks and sintering said individual lines, but before said step of forming a second inter-layer insulating film;
• and
• forming block lines connected to respective block electrodes and forming block bonding pads connected to respective block likes after said steps of sintering the block electrode in each of said plurality of blocks and sintering said individual lines.