Method and apparatus for detecting optimal endpoints in plasma etch processes
AssigneeLam Research Corporation
InventorAlexander F. Liu
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AssigneeLam Research Corporation
InventorAlexander F. Liu
Estimating the term…
An improved method for specifying and reliably detecting endpoints in processes such as plasma etching, where the signal-to-noise ratio has been severely degraded due to factors such as “cloudy window” and low ratio of reactive surface area to non-reactive surface area. The improved method of the invention samples signals produced by photo sensitive equipment, digitally filters and cross-correlates the data, normalizes the data using an average normalization value, and provides further noise reduction through the use of three modes of endpoint specification and detection. The three modes of endpoint specification and detection require a pre-specified number of consecutive samples to exhibit a certain behavior before the endpoint is deemed detected and the process terminated as a result. The three modes of endpoint specification and detection also permit a very fine control of the etch time by permitting the user to adjust the specified endpoint by gradations of the sampling period. The improved method of the invention is capable of being implemented on known apparatus.
A method of detecting an endpoint for terminating a process, said method comprising the steps of:
An apparatus for detecting an endpoint for terminating a process, comprising:
A method of detecting an endpoint for terminating a process, said method comprising the steps of:
A method of detecting an endpoint for terminating a process, said method comprising the steps of:
A method of detecting an endpoint for terminating a process, said method comprising the steps of:
An apparatus for detecting an endpoint for terminating a process, comprising:
An apparatus for detecting an endpoint for terminating a process, comprising:
An apparatus for detecting an endpoint for terminating a process, comprising:
Dependencies are inferred from the claim text.