Radiation-sensitive resin composition
AssigneeJsr Corporation
InventorsAtsushi Shiota, Masako Suzuki, Hozumi Sato
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Abstract
A radiation-sensitive resin composition comprising: (A) a phenol resin, (B) an amino resin, (C) a compound having two or more crosslinking groups in a molecule, and (D) a halomethyl-1,3,5-triazine compound. The composition can form insulating layers exhibiting high resolution, high plating solution resistance, high adhesion to conductor wiring, and developability using an alkaline aqueous solution, producing cured insulating layers with superior solvent resistance, excellent waterproofing characteristics, and high heat resistance. The composition is useful for fabricating multilayered wiring boards.
Claims8
A radiation-sensitive composition, comprising:
- (A) a phenol resin;
- (B) an amino resin;
- (C) a compound having two or more cross-linking groups in a molecule, and which groups are selected from the group consisting of epoxy, thiiranyl, oxetanyl, and vinyl ether;
- and
- (D) a halomethyl-1,3,5-triazine compound which is selected from the group of compounds having either of the following formulae (O) or (Q):
- wherein X is halogen, and R4 represents
- wherein R5 is alkyl;
- R6 is alkyl or phenyl;
- r is 0 or l;
- and R7 is —O—, —CH2—, —C(CH3)2—, —C(CF3)2—, or —SO2—;
- or
- wherein X is a halogen atom, u is an integer from 1 to 3, v is O or 1, and R9 represents the following group (b), or (c):
- wherein R10 is halogen, cyano, —N(C2H5)2—, or
Dependencies are inferred from the claim text.