Circular interconnect

Abstract

The present invention relates to an apparatus that forms a polymeric structure. The apparatus has a mold plate, a circular trench, a male and female interconnect, a vertical gap filler, and a cylinder. The mold plate has a predetermined geometric design. The circular trench is in the mold plate and the difference between the outer diameter and the inner diameter of the circular trench is a distance D. The male interconnect and the female interconnect are interspaced between each other. Each interconnect rotates within the circular trench and has a base and an interconnection portion. Each base has a width D and slidably mates to the mold plate. Each interconnect portion has a minimum width W which is less than D. The male interconnect portion protrudes downwards relatively from its base to a distance P, likewise the female interconnect portion protrudes upwards relatively from its base to a distance P. The vertical gap filler aligns with the circular trench and has a foundation and an extension. The extension has a width greater than W, a height greater than 2P, and protrudes upwards and downwards from its foundation. The cylinder rotates each interconnect to a predetermined position and raises the vertical gap filler so the foundation connects to the mold plate before any polymeric material is applied to the apparatus to form the polymeric structure. Once the polymeric structure is formed, the cylinder lowers the vertical gap filler until the extension is below the mold plate a distance greater than P and rotates each interconnect so the polymeric structure can be removed from the apparatus.

Dependencies are inferred from the claim text.