Ultrasonic transducer
AssigneeThe Hong Kong Polytechnic University
InventorsHelen Lai Wa Chan, Siu Wing Or, Kei Chun Cheng, Chung Loong Choy
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Abstract
A bonding tool for applying pressure and ultrasonic energy simultaneously to join miniature components together includes an ultrasonic driver having four composite wafers separated by electrodes. Such bonding tools are known that use wafers made of wholly of ceramic material. By using wafers having four sector parts of ceramic material separated by layers of polymer as shown, bonding tools are provided with broader bandwidth operation and reduced spurious resonance modes.
Claims5
A bonding tool for applying pressure and ultrasonic energy simultaneously to join miniature components together comprising an ultrasonic driver having a plurality of thin piezoelectric wafers held under mechanical pressure against each other, in which at least one of the wafers is a ceramic/polymer composite having at least two ceramic parts that are separated from one another by a layer of polymer material extending in a plane parallel to the thickness direction of the wafer.
Dependencies are inferred from the claim text.