Lamination method
AssigneeSharp Kabushiki Kaisha
InventorsMasaharu Akitomo, Tetsurou Koyama
Life of this patent
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Abstract
A lamination method, which is a method in which a dry resist film, formed by providing a color resist layer on a base film, is cut based upon the length of a substrate in the feeding direction, and press-bonded onto the substrate, and then the color resist layer is transferred onto the substrate by separating the base film, is provided with the following steps: in the cutting process, cutting the film so that the rear end of the dry resist film, after the press-bonding, extrudes from the rear end of the substrate by a predetermined width; and cutting the dry resist film again at a position inside the rear end of the substrate prior to separating the base film after the dry resist film has been press-bonded so as to eliminate the portion of the dry resist film extruding from the substrate.
Claims18
A lamination method, which is a method in which a film, formed by providing a resin layer on a belt-shaped support, is cut based upon a length of a substrate in a feeding direction, and press-bonded onto the substrate, and then the resin layer is transferred onto the substrate by separating the belt-shaped support, comprising the steps of:
- in the cutting process, cutting the belt-shaped support and the resin layer of the film so that a rear end of the film, after the press-bonding, protrudes from the rear end of the substrate by a predetermined amount;
- and
- cutting the belt-shaped support and resin layer of the film again at a position inside the rear end of the substrate prior to separating the belt-shaped support after the film has been press-bonded so as to eliminate a portion of the film protruding from the substrate.
A lamination method using an intermittent laminating device for intermittently bonding onto a substrate a film supplied from a film source and comprised of a photosensitive layer and a base layer, the method comprising the steps of:
- (a) transporting said substrate relative to said intermittent laminating device;
- (b) laminating said film onto said substrate beginning in the vicinity of a leading end of said transported substrate;
- (c) supporting portions of said film supplied from said film source until these portions are laminated onto said substrate;
- (d) a first cutting process for completely cutting said film so that said film projects from a trailing end of said transported substrate, the amount that said film projects being sufficient to permit support of said film supplied from said film source until said film is laminated onto the trailing end of said transported substrate;
- and
- (e) a second cutting process for completely cutting said film so that the portion of said film that projects from the trailing end of said substrate is eliminated.
Dependencies are inferred from the claim text.