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US 6,190,425 B1Granted
Memory bar and related circuits and methods
AssigneeZomaya Group, Inc.
InventorsRashwan B. Darwish, Trung Huynh
Life of this patent
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Abstract
A memory bar for use in high density memory modules. A memory bar comprises a substrate that provides a mounting for at least two IC chips, such that the substrate and associated IC chips may be mounted, for example, on one side of a memory module.
Claims4
A method of manufacturing a stacked memory product, said method comprising the steps of:
- using a pick-and-place machine, placing a first set of memory chips in an inverted position within a plurality of cavities provided within a memory bar substrate;
- soldering the placed first set of memory chips in a first set of predetermined positions;
- turning the memory bar substrate over;
- using a pick-and-place machine, placing a second set of memory chips in an upright position on said memory bar substrate;
- and
- soldering the placed second set of memory ships in a second set of predetermined positions.
3 more elements
A method of manufacturing a stacked memory product, said method comprising the steps of:
- using a pick-and-place machine, placing a first set of memory chips in a first set of predetermined positions on a memory bar substrate;
- soldering the placed first set of memory chips in said first set of predetermined positions;
- turning the memory bar substrate over;
- using a pick-and-place machine, placing a second set of memory chips in an inverted orientation within a plurality of apertures provided within said memory bar substrate, such that pins provided on said second set of memory chips are positioned within a second set of predetermined positions on said memory bar substrate;
- and
- soldering the pins of said second set of memory ships in said second set of predetermined positions.
3 more elements
Dependencies are inferred from the claim text.