Heat sink with a heat pipe for spreading of heat
AssigneeIntel Corporation
InventorsLloyd Jack Goodman, Chai-Pin Chiu, Abhay W. Watwe, Ram Viswanath
Life of this patent
Estimating the term…
Abstract
The invention provides a heat sink for cooling and electronic device. The heat sink includes a member, and a heat pipe secured to the member. The member has a first portion, a second portion, and a plurality of fins on the second portion. The heat pipe has a first, evaporator section and a second, condenser section. The first section is located at the first portion so that heat can be transferred thereto from a heat generating component of the electronic device. The second section is located at the second portion so that heat can be transferred therefrom to the second portion.
Claims17
A heat sink for cooling an electronic device, which includes:
- a member having a first portion, a second portion and a plurality of fins on the second portion and the fins extending in at least two different directions from the second portion;
- and
- a heat pipe secured to the member, the heat pipe having a first, evaporator section at the first portion so that heat can be transferred thereto from a heat generating component of the electronic device, and a second, condenser section at the second portion so that heat can be transferred therefrom to the second portion, the heat pipe changing direction at least once between the first section and the second section.
A heat sink for cooling an electronic device, which includes:
- a member having a first plate portion in a first plane, a second plate portion in a second plane which is different to the first plane, and a plurality of fins on the second plate portion and the fins extending in at least two different directions from the second portion;
- and
- a heat pipe secured to the member, the heat pipe having a first, evaporator section against the first plate portion so that heat can be transferred thereto from a heat generating component of the electronic device, and a second, condenser section against the second plate portion so that heat can be transferred therefrom to the second plate portion, the heat pipe changing direction at least once between the first section and the second section.
An assembly which includes:
- an electronic device having a heat generating component;
- a member mounted to the electronic device over the components, the member having a first portion and a second portion located distant from the component, and a plurality of fins on the second portion the fins and extending in at least two different directions from the second portion;
- and
- a heat pipe secured to the member, the heat pipe having a first, evaporator section at the component so that heat can be transferred from the component to the first section, and a second condenser section at the second portion so that heat can be transferred from the second section to the insert portion, the heat pipe changing direction at least once between the first section and the second section.
Dependencies are inferred from the claim text.