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US 6,188,838 B1Granted
Apparatus for heat treating a semiconductor wafer to reduce stress
AssigneeKabushiki Kaisha Toshiba
InventorsYuichi Mikata, Akihito Yamamoto
Life of this patent
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Abstract
A susceptor in a semiconductor wafer heat treatment apparatus holds a wafer such that the wafer is made flat at a heat treatment temperature. In particular, the susceptor is constituted by an elastic platy member which is convex upward with respect to the direction of the gravity. Therefore, when the wafer is subjected to a high-temperature heat treatment, a crystal defect in the wafer can be suppressed.
Claims11
An apparatus for semiconductor wafer heat treatment, comprising:
- a susceptor for holding a wafer, comprising an elastic platy member which is convex upward with respect to a direction of gravity, and generating stress between the susceptor and the wafer;
- a jig for supporting said susceptor such that the stress caused by said susceptor is canceled out by stress caused by a gravitational load of the wafer and the wafer is made flat at a heat treatment temperature;
- and
- a heater for heating the wafer held by said susceptor.
1 more element
Dependencies are inferred from the claim text.